FM22LD16-55-BG | Cypress Semiconductor
FM22LD16-55-BG
| Development Kit | N |
| 인증 자동차 | N |
| 밀도(Kb) | 4096 |
| 주파수(MHz) | 해당 없음 |
| 인터페이스 | Parallel |
| 최대 작동 온도(°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| 최대 작동 전압(V) | 3.60 |
| 최소 작동 온도(°C) | -40 |
| Min. Operating VCCQ (V) | 2.70 |
| 최소 작동 전압(V) | 2.70 |
| 구성(X x Y) | 256Kb x 16 |
| Part Family | Parallel FRAM |
| 속도(ns) | 55 |
| Tape & Reel | N |
| 온도 분류 | 산업 |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $46.93 | $41.99 | $37.79 | $33.35 | $32.36 | $31.12 |
Packaging/Ordering
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS 준수
무연
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
기술 문서
제품 변경 고지(PCN) (1)
2020년 4월 14일
Qualification of Texas Instruments’ DMOS6 as an Additional Wafer Fab Site, Test 25 as an Additional Wafer Sort Site, OSE-Taiwan as an Additional Assembly Site for 44-TSOP II Package with Copper Wire for the 4Mb Parallel Industrial-Grade Product Family
Product Information Notice (PIN) (7)
2020년 4월 14일
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
2017년 11월 06일
Changes to F-RAM Minimum Order Quantities, Order Increments, and Factory Order Increments to Align with Cypress Standards
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